On Semi公司的Q32M210是精密的混合信號32位MCU, 集成了2個16位模數轉換器、高精度電壓參考、3個10位數模轉換器和基于ARM® Cortex-M3 32位內核以及高度可配置的模擬前端及可編程的32位內核和256kB閃存.芯片還集成所有關鍵功能，包括實時時鐘、電源管理、112段液晶顯示屏(LCD)接口、片上低阻抗開關、非限定(uncommitted)運算放大器、精密電壓參考(< 50 PPM/℃)及電阻電容(RC)振蕩器。器件具有高精度感測,可預測工作以及低功耗等特性,主要用于便攜感測應用如病人監測器、無線心電圖機(ECG)和血糖儀等便攜醫療設備.本文介紹了Q32M210主要特性,方框圖, 正常工作條件配置圖以及典型和擴展電源配置圖, 血糖儀應用電路圖和相應的材料清單.

Q32M210 is a precision, mixed−signal 32−bit microcontroller. Themicrocontroller is built on the high performance ARM?Cortex_−M3 processor.

The microcontroller incorporates a highly configurable sensor interface designed to work directly with a wide range of sensors having multiple characteristics, including specialized electrochemical sensors. The sensor interface includes dual programmable gain amplifiers, dual 16−bit Analog−to−Digital converters, triple 10−bit Digital−to−Analog converters (for voltage waveform generation and other applications) and three uncommitted, low−noise opamps with configurable signal multiplexing. Flexible connectivity to external non−volatile memory, personal computers, wireless devices, LCD displays and a wide range of other peripherals is enabled by several digital interfaces including I2C, USB (2.0 full−speed compliant) and a high−speed SPI/SQI interface.

The microcontroller features flexible clocking options as well as intelligent failure monitoring of power and application interruptions required by high performance, portable, battery operated applications.

All necessary clocks including an internal oscillator, real−time clock and a dedicated clock for USB operation are available on−chip (external crystals required for RTC and USB).An embedded power management unit, which incorporates several low power modes, allows application developers to minimize both standby and active power under a wide range of operating conditions.

The ultra−low sleep current makes the microcontroller ideal for applications that remain inactive for long periods of time. A large on−chip non−volatile flash memory (256 kB) combined with on−chip SRAM (48 kB) supports complex applications and simplifies application development. The flash contains built−in hardware error checking and correction (ECC) for application reliability. Additionally, a configurable DMA unit which supports independent peripheral−to−memory, memory−to−memory, and memory−to− peripheral channels provides flexible, low power data transfers without processor intervention.

A suite of industry−standard development tools, hands−on training and full technical support are available to reduce design cycle time and speed time−to−market.

Q32M210 主要特性:

Ultra Low−Power and Smart Power Management

Less than 400 _A / MHz, up to 16 MHz clock speed

Reliable operation down to 1.8 V; 3.3 V nominal supply voltage

Ultra−low−current sleep mode with Real−time Clock active (< 750 nA)

Low−current standby mode with register and SRAM retention (< 26 _A)

Integrated power supplies minimize need for external components. Only a minimum of external passives is required

Efficient, Powerful and Robust Processing Architecture

32−bit ARM Cortex−M3 CPU

256 kB on−chip flash with integrated hardware ECC for program and user data storage

48 kB on−chip SRAM

Flexible DMA, 4 general−purpose timers, CRC calculator

No external voltage required for flash write operation

Low−Noise, Low−Leakage, Low−Temperature Drift, Configurable Sensor Interface

Triple ultra low−noise opamps with low−leakage inputs and configurable outputs

Dual on−chip Programmable Gain Amplifiers (PGA) and ADCs with flexible input multiplexing and wide dynamic range

Reconfigurable voltage detection unit

Optimal dynamic range scaling of sensor signals

Flexible on−chip signal routing for dynamic reconfigurability

Minimal temperature drift of gain and offset errors allows for precise calibration

Built−in Temperature Sensor

Predictable Operation

Dedicated brown−out protection circuit prevents execution of code outside of operating range

Integrated hardware−based ECC for on−chip flash maintains code and data integrity

Watchdog timer

High Precision Analog−to−Digital Conversion and Digital−to−Analog Conversion

Dual 16−bit ADCs with on−the−fly data rate configurability

Triple 10−bit DACs with configurable dynamic range

Precision Voltage Reference

On−chip, low temperature drift (< 50 ppm/?C) voltage reference for ADCs and DACs

Flexible On−Chip Clocking

Processor supports speeds up to 16 MHz provided either through internal oscillator or externally supplied clock

Flexible Sensor Interconnections

Triple low Ron analog multiplexers, including an 8:1 input mux

Quad SPST and quad multi−switches for effective simultaneous connection to different sensors

USB 2.0 Full−Speed Interface

Built−in transceiver for 2.0 Full−speed compatible (12 Mbps) operation with dedicated power supply

Flexible External Interfaes

Configurable Interface Wakeup pins with configurable pull−ups and pull−downs

8 Configurable GPIO interrupts

Dual UARTs, dual SPI, SQI, I2C, PCM (including I2S mode), GPIOs

LCD Interface

Up to 112 segments with integrated charge pump and backlight driver (up to 10 mA)