中圖分類號(hào)：TN912 文獻(xiàn)標(biāo)志碼：A DOI: 10.16157/j.issn.0258-7998.223511
中文引用格式： 李天宇，周靜雷，李佳斌. 基于磁-熱耦合的揚(yáng)聲器溫度場仿真研究[J]. 電子技術(shù)應(yīng)用，2023，49(8)：103-107.
英文引用格式： Li Tianyu，Zhou Jinglei，Li Jiabin. Simulation of loudspeaker temperature field based on magnetic-thermal coupling[J]. Application of Electronic Technique，2023，49(8)：103-107.

Simulation of loudspeaker temperature field based on magnetic-thermal coupling

Abstract： Moving coil loudspeaker may experience thermal damage such as open circuit, short circuit, and debonding when driven by large signals due to severe heating of the voice coil, resulting in damage to the speaker unit. By establishing a three-dimensional finite element model of a moving coil loudspeaker unit, the steady-state temperature and stress fields of the speaker unit were simulated under large signal driving based on multi physical field coupling, and the simulation results were verified through experiments. The results show that under the action of a constant voltage power amplifier, the overall temperature of the speaker unit first increases and then decreases with the increase of the frequency of the voice coil current. The temperature of the speaker unit reaches its peak at the rated impedance point, and the equivalent stress is concentrated at the connection between the voice coil skeleton, centering support, and diaphragm, which may cause heating faults due to high temperature. At the same time, the impact of thermal damage to the voice coil on the transient temperature field of the speaker unit was analyzed. This result can provide reference for temperature monitoring and failure analysis of moving coil loudspeaker.

Key words : magnetothermal coupling；moving coil loudspeaker；finite element method；numerical simulation