1.School of Reliability and Systems Engineering，Beihang University，Beijing 100191，China； 2.China Aerospace Science & Industry Corp Defense Technology R&T Center，Beijing 100854，China
Abstract： In the research of near-field electromagnetic radiation test, there is no complete set of test methods for individual components. Aiming at this problem, a near-field electromagnetic radiation test method for System in Package(SiP) devices is researched based on surface scanning method. Firstly, the internal structure of the SiP device is researched by X-ray and the source of interference is analyzed. Secondly, the hardware and software layer is built to make the device work. Thirdly, a near-field testing system is built to implement near-field test of DUT. In the case research, the SiP device used is encapsulated with peripherals and a processor which is the main interference source. The near-field test results show that the radiation on PCB is mainly concentrated around SiP device, and the near-field radiation of device is concentrated at processor chip. Case research results show that this kind of test method can effectively measure the SiP device of near field electromagnetic radiation, and analyze the interference sources inside the device.
Key words : System in Package(SiP)；electromagnetic radiation；surface scanning method；near field scanning test
0 引言
21世紀(jì)后的電子產(chǎn)品都在追求一個(gè)相同的目標(biāo)：便攜、輕薄。這對(duì)現(xiàn)代半導(dǎo)體設(shè)備的輕量小型化、綜合化[1]以及高可靠性提出了更高的要求，如何在這方面取得突破也成為微系統(tǒng)領(lǐng)域的一個(gè)研究熱點(diǎn)[2]。但技術(shù)發(fā)展同時(shí)也暴露出許多問(wèn)題：光刻技術(shù)受限；散熱、漏電問(wèn)題；高集成度影響芯片性能；成本問(wèn)題[3]等。因此研究者們開始著眼于封裝技術(shù)，如系統(tǒng)級(jí)封裝(System in Package，SiP)。它是指多個(gè)有源器件的組合，這些功能不同的器件被組裝在一個(gè)單元中，單元提供系統(tǒng)或子系統(tǒng)功能[4-9]。這種具有3D封裝特色的封裝方案[10]不僅極大程度縮減封裝體積，還具有開發(fā)周期短、低成本、低功耗、高性能的優(yōu)點(diǎn)，能提高生產(chǎn)效率，簡(jiǎn)化系統(tǒng)開發(fā)，提升開發(fā)彈性與靈活度，降低供應(yīng)鏈管理難度，這也使SiP器件在宇航、武器裝備、可穿戴設(shè)備以及物聯(lián)網(wǎng)等領(lǐng)域里得以廣泛應(yīng)用[7-8，11-15]。
